*Dual-Side Wafer Processing
→ Front or back-side wafer processing
*Small footprint
*No cross contamination
*Less chemical consumption
*State of the art technology
*Adaptable configuration
*Integrated chemical system
*Small footprint by standardized Design
& size
*Equipment manufacturing system through
3D design (Unit & Piping)
*Low Price
*Software / Hardware Reliability
*Diverse experience on FAB Turn-Key
project (Over Sea, Domestic)
*Patent on Wafer Transfer Robot
▪ Fully automated wafer handling
→ recipe-driven system (GUI)
▪ Customized recipe management
→ Sort, spilt, gather function etc.
▪ Small foot print
▪ Stand alone or Inline system
▪ Dual arm robot for Maximum throughput
▪ Compatible with FOUP, FOSB and various cassette type (200mm)
▪ Configurable load por
